英语翻译1.Epoxy Laminate and PrepregHigh Thermal Reliability / F

英语翻译
1.Epoxy Laminate and Prepreg
High Thermal Reliability / Fast Cure / Lead-free
2.IS410 is a high-performance FR-4 epoxy laminate & prepreg system designed to support the printed circuit board industry's requirements for higher levels of reliability and the trend to lead-free solder.
3.Isola's IS410 has a Tg of 180 degrees C and is specially formulated for superior performance through multiple thermal excursions,passing 6X solder tests at 288 degrees C.IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of less than or equal to 10 mils.Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built
4.with small feature designs.Along with these attributes,IS410 brings improved productivity with its fast cure system while using current fabrication techniques.
5.Performance and Processing Advantages
High Thermal Performance
Tg of 180 degrees C (DSC)
Superior performance through multiple thermal excursions
-Passes 6X @ 288 degrees C
Fast Cure
Unique chemistry increases throughput with reduced press time

都是一些IS410的性能介绍,没什么大用途,各个PCB网站上都有一些它的足迹,是常用的PCB板材.
下面帮你翻译了一下,E文不好,不要见笑,还望高手指点'^_^
1.Epoxy Laminate and Prepreg
1.环氧树脂预浸层压板
High Thermal Reliability / Fast Cure / Lead-free
高热稳定性/快恢复/不含铅
2.IS410 is a high-performance FR-4 epoxy laminate & prepreg system designed to support the printed circuit board industry's requirements for higher levels of reliability and the trend to lead-free solder.
2.IS410 是一种高性能的 FR-4环氧树脂预浸层压板体系,用于设计和解决印刷电路板工业追求高水平和高可靠性及无铅焊接的需求.
3.Isola's IS410 has a Tg of 180 degrees C and is specially formulated for superior performance through multiple thermal excursions,passing 6X solder tests at 288 degrees C.
IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of less than or equal to 10 mils.Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built
3．IS410 它的Tg值为180摄氏度,特别有效果的和出色的整体多重热转移性能,经过6次288摄氏度的焊接.IS410的最高允许或同等于10 mils宽高比的孔.它的独特的化学树脂CAF 阻抗有助成为长期可靠的基板.
4.with small feature designs.Along with these attributes,IS410 brings improved productivity with its fast cure system while using current fabrication techniques.
4．这些特性使IS410成为具有小规模设计的能力,有效的改良生产速度的体系.
5.Performance and Processing Advantages
High Thermal Performance
Tg of 180 degrees C (DSC)
Superior performance through multiple thermal excursions
-Passes 6X @ 288 degrees C
Fast Cure
Unique chemistry increases throughput with reduced press time
5．性能和处理优势
高热稳定性
Tg值 180 摄氏度（DSC）
出色的整体多重热转移性能,经过 6X@ 288摄氏度测试
快恢复性
独特的化学增量性能减少印刷时间
附
FR-4说明：
基材是树脂加玻纤布,玻纤布就是玻璃纤维的织物,将玻纤布在液态的树脂中浸沾,再压合硬化得到基材.韧性较好,断裂时有丝互相牵拉,常用于多面板、计算机、通讯设备等档次的电子产品.
Tg说明：
电路板必须耐燃,在一定温度下不能燃烧,只能软化.这时的温度点就叫做玻璃态转化温度(Tg点),这个值关系到PCB板的尺寸安定性.