想找个专业人士帮我用英文翻译一下FPC的生产流程

想找个专业人士帮我用英文翻译一下FPC的生产流程
下面是一个大楷的FPC的生产流程，简约与不足之处望您体谅。Thank you very much!
FPC所用到的材料
1，原材料
（1）有胶材料，无胶材料；材料上的铜分电解铜与压延铜，无胶压延铜的材料柔性，折叠性比较好。
（2）材料的厚度：PI+铜厚
2，覆盖膜
覆盖膜由PI和胶组成.
3，补强
补强一般有以下几种；PI补强，PED补强，FR4补强，钢片补强等，一般补强的厚度有，PI1/2 1/2，PI11，PI21，PI31 到PI91，PI后的两为数值分别代表PI的厚度与胶的厚度，单位为Mil。厚度根据客户要求而定。
4，纯胶
纯胶的主要用于多层板的叠层和分层板，也有用于粘接补强。
5，屏闭膜
主要起到信号屏闭作用，而且要接地。
6，3M胶
粘接补强与用于固定FPC 等作用。
双面FPC的生产流程
（1）开料
材料的大小有规定，材料大小的长度一面固定是250mm，另一面的长度大小随着panel的需求而定。根据Panel的大小而裁定材料的大小.
（2）钻孔
PTH，定位孔，方向孔
（3）PTH
通过镀液的自催化氧化还原反应，使桶离子镀在经过活化处理的的孔壁上，为下一步的电镀做准备，使铜壁上的铜厚达到一定的厚度，从而达到导通的作用。
（4）电镀
提高孔内镀层均匀性，保证整个版面（孔内及孔口附近的整个镀层）镀层厚度达到一定的要求。
（5）前处理，
清洗板面，处理板面的氧化物，油腻等
（6）贴干膜，
PE，感光阻剂和PET组成，在板在贴上干膜，从而达到影象转移的功能，在蚀刻的过程中起到保护线路的作用。
（7）曝光，贴上干膜后会发生有机聚合反应，曝光后会在板面形成线路图形，
（8）显影
没被光照到的干膜部分会被NACO3清洗掉，线路和有铜的部分上面的干膜不会被洗掉
（9）蚀刻
没有干膜部位的铜会被蚀刻溶液（HCL，H2O2，CUCL）蚀刻掉，从而去掉多余的铜。
（10）
检查：蚀刻后的线宽，线距，有没有开路和蚀刻不净而造成的短路。
（11）
清洗（前处理）：为贴保护膜做准备，必须要保证板面清洁
（12）贴保护膜
保护膜和PCB的Solser mask的作用是一样的，通过保护膜上的胶使板和PI粘贴在一起
（13）压合
PI上的胶要同过一定的温度和压力才能更好的粘贴在一起。
（14）刷板
清洗掉板面的杂质
（15）表面处理
表面处理有沉金，电金，喷SN，沉SN，抗氧化。
（16）印刷字符，根据客户要求而定
（17）ET，检查开路，短路，确保品质
（18）装配，有的需要整个PANEL的去贴补强，有的需要单个的去贴，根据CAM的设计而决定。
（19）
啤房，把PANEL上的单个板通过冲床冲切下来，也可以通过激光来剪切。
（20）FQC
品质的检查，最终检查出在生产过程中有可能产生的不良问题。
（21）包装出货

The following is a BLOCK of FPC production process, simple and weaknesses hope you understand. Thank you very much!
The materials used in FPC
1, raw materials
(1) plastic materials, non-gel material; material on the copper sub-rolled copper and electrolytic copper, rolled copper-free plastic material flexible, folding better.
(2) Material thickness: PI + copper thickness
2, covering film
And plastic covering film formed by the PI.
3, reinforcing
Reinforcement generally have the following; PI reinforcement, PED reinforcement, FR4 reinforcement, steel reinforcement, are generally reinforced the thickness, PI1 / 2 1 / 2, PI11, PI21, PI31 to PI91, PI after The two values represent the PI for the thickness and adhesive thickness, unit Mil. Thickness according to customer request.
4, pure gum
Pure rubber is mainly used for multilayer laminated and layered plates, but also for bonding reinforcement.
5, screen closed membrane
Played a signal role in the main screen closed, but also grounded.
6,3 M glue
Bonding with the reinforced role for the fixed-FPC, etc..
Double-sided FPC production process
(1) is expected to open
The size of the material provisions of the size of the length of the side of the fixed material is 250mm, the other side of the length of the size as the panel's requirements. According to the size of the Panel ruled that the size of the material.
(2) drilling
PTH, positioning holes, the direction of hole
(3) PTH
Through the bath from the oxidation reduction reaction ion plating barrel after activation of the pore walls in preparation for the next step of plating, copper wall thickness of copper reached a certain thickness, so as to achieve the role of conduction .
(4) plating
Improve the coating uniformity of the hole to ensure that the entire page (near the hole and orifice layer) with thickness of certain requirements.
(5) pre-treatment,
Clean sheets, and processing board surface oxides, greasy, etc.
(6) paste dry film,
PE, and PET photosensitive resist composition of the board in the paste dry film to achieve the image transfer function, in the process of etching circuits play a role in protection.
(7) exposure, paste, dry organic polymerization reaction occurs after exposure in the board after the formation of line graphics,
(8) develop
Not been to the dry part of the light will be NACO3 washed, line and some copper will not be washed off the top of the dry film
(9) etching
No dry parts of copper will be etched solution (HCL, H2O2, CUCL) etching away to remove excess copper.
(10)
Check: After etching line width, line spacing, do not have the net open and etching caused by short circuit.
(11)
Cleaning (before treatment): protective film to prepare for the stickers, we must ensure the board clean
(12) affixed protective film
Protective film and the role of PCB's Solser mask is the same, by protecting the membrane of the glue board and paste with PI
(13) Pressing
PI on the glue to the same over a certain temperature and pressure can be pasted together better.
(14) brush plate
Washed of impurities board
(15) Surface Treatment
Immersion Gold surface treatment, electric gold, spray SN, Shen SN, anti-oxidation.
(16) printing character, determined according to customer requirements
(17) ET, check the open circuit, short circuit, to ensure quality
(18) assembly, and some need to supplement the PANEL's strong, and some need to paste a single, determined according to the design of CAM.
(19)
Beer house, put on a single board PANEL punching down through the punch, but also to cut through the laser.
(20) FQC
Quality inspection, the final check out in the production process may produce adverse problems.
(21) for packaging and shipping